The new generation of memory: takeMS DDR2
 The Shuttle XPC P2 3700G also features the new takeMS RAM modules BD1024TEC910 – DDR2-667, with a capacity of one gigabyte. The takeMS modules successfully meet the demanding JEDEC-Specifications, and conform to German quality standards and the strict requirements of Intel.
This new standard of memory is the cornerstone for higher transfer rates and distinctively improved signal quality. To achieve this goal the whole chip architecture had to be redesigned. As a result, the new Fine-pitch-Ball-Grid-Array (FBGA) chassis design is less vulnerable to interference and the On-Die-Termination (ODT), free from signal distortions. The lowered voltage of 1.8 volts also means that heat spreading throughout the modules will be significantly reduced.
"Whoever makes the decision to change to DDR2 will profit from a significantly higher signal quality, which in turn will mean greater stability. With a board upgrade, DDR2 is a future-proof investment," explains Edmund Dägel of takeMS International AG.
The continuing support of chipset and main board manufacturers promises the introduction of a new generation.
takeMS offers a full warranty of 10 years for its all modules.
Features:
- 240-pin Unbuffered 8-Byte ECC DDR2 SDRAM Memory Module for PC and Workstation main memory applications
- Dual rank oranization 128Mx64
- JEDEC standard 1.8V I/O (SSTL_18-compatible)
- VDD = +1.8V ± 0.1V, VDDQ = +1.8V ± 0.1V
- 4-bit prefetch architecture
- Differential data strobe (DQS, DQS#) option
- Differential clock inputs (CK, CK#)
- Programmable CAS Latencies (3, 4 and 5), Burst Length (4 and 8)
- Posted CAS# additive latency (AL): 0, 1, 2, 3 and 4
- Auto Refresh (CBR) and Self Refresh Mode
- Off-Chip Driver (OCD) Impedance Adjustment
- On-Die Termination (ODT) supports termination values of 50, 75, and 150 ohms
- Serial Presence Detect (SPD) with EEPROM
- Module layout is based on JEDEC standard routing guidelines
- Impedance controlled 6-layer PCB Technology
- DQS edge-aligned with data for READs
- DQS center-aligned with data for WRITEs
- DLL to align DQ and DQS transitions with CK
- JEDEC standard form factor (133.35 mm x 30.0 mm)
- Operating Temperature 0°C ~ 95°C
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