Bienvenido al mundo de los mini PC de ShuttlePorqué XPCProductosAplicacionesxCommunityFuentes comercialesSoporteÁrea BusinessPrensa
FAQs|Technical Information|Download|Customer Service|Servicio de reclamo RMA|
General Information|XPCs|TFTs|XPC Barebones|XPC Accessories|
Support |

Adhesive thermal silicone gel on P4 CPU die?

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die.

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die. Since fan heatsink will stick strongly to the P4 CPU die and due to P4 Socket 423/478 ZIF socket structural design, upon removal of the heatsink will force P4 CPU to break apart from the ZIF socket thus damaging both pins on P4 CPU and ZIF socket. Please use non-adhesive thermal compound for P4 CPU only to avoid any damage done to the ZIF socket and P4 CPU.
back previous article send print
top
Búsqueda
Shuttle Newsletter

Dónde Comprar
El boletín informativo de Shuttle le informa sobre todas las novedades en torno a Shuttle.
atrás adelante
2009
20.10.2009 03:46:14