- Chassis
Slim 3-litre chassis, colour: black
Dimensions: 240 x 200 x 72 mm (LWH) = 3.5-litre
Weight: 2.2 kg net, 3.5 kg gross
Open front - without covers for front panel connectors
Hole for Kensington Lock on the back panel
Operation position horizontal or even vertical with the optional stand PS01 - Operation System
This system comes without operating system.
It is compatible with Windows 10 / 8.1 / 7 and Linux (64-bit).
Note: Windows 7 and 8.1 is only supported in combination with the 6th generation Intel Core processors "Skylake".
For an additional note on Windows 7, see [3] - Mainboard / Chipset / BIOS
Mainboard FH270, Mini-ITX form factor 17 x 17 cm
Chipset: Intel® H270 Chipset (code name "Union Point")
Platform Controller Hub (PCH) as Single-Chip-Solution
AMI BIOS in 8 Mbit EEPROM with SPI interface
All capacitors are high quality solid capacitors
Supports hardware monitoring and watch dog functionality
Supports Unified Extensible Firmware Interface (UEFI)
Supports power on after power failure [1]
Supports Firmware-TPM (fTPM) Version 2.0 - Power Adapter
External 120 W power adapter (fanless)
Input: 100~240 V AC, 50/60 Hz
Output: 19 V DC, max. 6.32 A, max. 120 W output wattage
AC Connector with protective-earth contacts, cable length: 1.7 m
DC Connector: 5.5 / 2.5 mm (outer/inner diameter) - Processor support
Socket LGA 1151 (H4) supports
Intel Core i7 / i5 / i3, Pentium and Celeron processors
- 6th generation, code name "Skylake"
- 7th generation, code name "Kaby Lake" [4]
Maximum supported processor power consumption (TDP) = 65 W
14 nm process technology, up to 8 MB of L3 cache
Not compatible with Intel Xeon E3 V5 processors for socket LGA 1151 and processors with the older Socket LGA 1150.
Does not support the unlock-function of Intel K-Series processors.
The processor integrates PCI-Express, memory controller
and the graphics engine on the same die (performance features
depending on processor type)
Please refer to the support list for detailed processor support information at global.shuttle.com. - Processor heat-pipe cooling
Processor cooling with heat-pipe technology and two fans (6 cm) - Storage Bays / RAID Support
This system features four drive bays
- Supports hard disks or SSDs in 2.5" / 6.35 cm form factor
- Maximum height of the drives: 9.5 mm
- Interface: SATA III (max. 6 Gbps)
- Included: four combo cables for data and power [8]
- Supports RAID modes 0, 1, 5, 10 - Memory support
2x SO-DIMM slot with 260 pins
Supports DDR4-2133/2400 (PC4-17066/19200) SDRAM at 1.2 V
Supports maximum total size of 32 GB (max. 16 GB per module)
Supports Dual Channel mode
Supports two unbuffered DIMM modules (no ECC) - Integrated Graphics
The features of the integrated graphics function
depend on the processor used.
Three video outputs:
support three independent displays simultaneously
(1) DisplayPort 1.2 - supports 1080p/60Hz and 2160p/60Hz
(2) HDMI 1.4 - supports 1080p/60Hz and 2160p/30Hz
(3) D-Sub/VGA
The digital video ports (DisplayPort and HDMI) support Blu-ray (BD) playback with HDCP. These ports transmit HD video plus multi-channel digital audio via a single cable. - 5.1-channel audio
Audio Realtek® ALC 662 5.1-channel High-Definition Audio
Three analog audio connectors (3.5 mm) at the back panel:
(1) Front line-out (head-phones)
(2) Rear Surround line-out (shared with microphone input)
(3) Center line-out (shared with line-in)
Digital audio output is provided by HDMI and DisplayPort - Dual LAN Controller
Dual network with two RJ45 ports
Used network chips:
2x Intel i211 Ethernet Controller with MAC, PHY and PCIe interface
Supports 10 / 100 / 1.000 MBit/s operation
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Environment (PXE)
Supports Teaming mode [5] - M.2-2280 SSD slot
The M.2 2280 BM slot provides the following interfaces:
- PCI-Express Gen. 3.0 X4 (max. 32 Gbps), supports NVMe
- SATA v3.0 (max. 6 Gbps)
It supports M.2 cards with a width of 22 mm
and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
Supports M.2 SSDs with SATA or PCI-Express interface - Intel® Optane™ Ready
The XH270 supports Intel® Optane™ Technology
which accelerates the speed of one hard disk through data caching.
This requires a 7th gen. Intel Core processor ("Kaby Lake")
and an Optane-SSD with 3D-Xpoint memory (e.g. in M.2 format). - M.2-2230 slot for WLAN cards
Interfaces: PCI-Express Gen. 2.0 X1 und USB 2.0
Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
Supports WLAN extension cards (optional Shuttle accessory WLN-M [7]) - Front Panel connectors
Microphone input
Audio Line-out (headphones)
2x USB 3.0
2x USB 2.0
Power button
Power LED (blue)
HDD LED (yellow) - Back Panel connectors
1x DisplayPort 1.2 - digital Audio/Video output
1x HDMI 1.4 - digital Audio/Video output
1x D-Sub/VGA - analog Video output
2x USB 3.0
2x USB 2.0
2x GigaBit LAN (RJ45)
1x Serial COM port (RS232)
Audio Line-in
Audio Line-out
Audio Mic-in
Clear CMOS Button
Perforation for Wireless LAN antennas (2 holes)
Hole for Kensington Lock - Other onboard connectors
Power-on-after-power-fail (hardware solution, Jumper 4) [1]
Front connectors for power button, LEDs, USBs, audio ports
Three headers 2x5-pin for dual USB 2.0 (one occupied)
One 4-pin fan connector (occupied by the CPU cooling system)
LPC interface (2x10-pin header, 2 mm pitch) - Supplied Accessories
Multi-language installation guide (EN, DE, FR, ES, JP, KR, SC, TC)
Driver DVD
4x Combo SATA/power cable for 2.5" drives
External power adapter with 1.7 m AC power cord (with protective-earth contacts)
Protector cap for the CPU socket (do not use, if heat-pipe or fan is mounted)
CPU heatpipe cooling system with heatsink compound
Bag with screws - Optional Accessory
(1) Vertical stand (PS01)
(2) VESA mount (PV02)
(3) WLAN module (WLN-M) [7] - Environmental Specifications
Operating temperature range: 0~50 °C [6]
Relative humidity range: 10~90 % (non-condensing) - Conformity and Certifications
EMI: FCC, CE, BSMI, C-Tick
Safety: CB, BSMI, ETL
Others: RoHS, Energy Star V5.0, EuP Lot 6
This device is classed as a technical information equipment (ITE)
in class B and is intended for use in living room and office.
The CE-mark approves the conformity by the EU-guidelines:
- EMV-guideline 89/336/EWG electromagnetic tolerance
- LVD-guideline 73/23/EWG use of electric devices
within certain voltage-limits
[1] Power on after power fail:
The BIOS setup provides a "Power-on-after-power-fail" function that can be found under "Power Management Configuration". As the name indicates, this function determines the PC's behaviour after power failure: (1) unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of this function, it may fail after short power failures. This is why the XH270 also comes with a hardware-based solution. By removing Jumper 4 (on the mainboard near the "Shuttle" printing), the system will start unconditionally once power is supplied.
[2] How to convert DisplayPort into HDMI/DVI
The DisplayPort output can be converted to HDMI or DVI by an additional, passive adapter cable. For example:
DELOCK 82590: 1 m, DisplayPort (male, 20p) to HDMI-A (male, 19p)
DELOCK 82435: 5 m, DisplayPort (male, 20p) to DVI-D (male, 24p)
The integrated graphics automatically detects the connected display and puts out the appropriate electric signal - either DisplayPort (without an adapter) or HDMI/DVI (with an adapter).
However, a monitor with a DisplayPort connector cannot be connected to the HDMI port with a simple, passive adapter.
[3] Installation of Windows 7
Intel® 100 chipset series has been removed support for the Enhanced Host Controller Interface (EHCI) which is the driver software for the USB 2.0 ports. The new chipset only supports the updated Extensible Host Controller Interface (xHCI for USB 3.0) which is not supported over the original Windows 7 installation disk. This means, that peripheral devices connected by USB (like keyboard, mouse and external optical drive) do not work during Windows 7 installation. Therefore please add the required USB 3.0 drivers to the Windows 7 installation files manually. This procedure is explained in the Shuttle FAQ section at faq.shuttle.com.
[4] Use of Kaby Lake processor
If a Kaby Lake processor is used, this XPC will only support Windows 10 and Linux operating systems. Windows 7 and 8.1 will no longer be supported.
[5] Teaming Mode
The teaming function allows you to group both available network adapters together to function as one single adapter. The benefit of this approach is that it enables load balancing and failover.
Driver download: https://downloadcenter.intel.com/download/21642
[6] High ambient temperature
For high ambient temperatures over 40°C we strongly recommend to use SSDs instead of hard disk drives.
[7] Optional Wireless LAN module:
This Shuttle XPC slim Barebone supports the optional Shuttle XPC Accessory WLN-M which consists of a M.2-2230 card with IEEE 802.11ac and BT4.0 functionality and two external antennas with appropriate antenna cables.
[8] Power connector for SATA drives
The supplied power cables for SATA drives provide a voltage of 5 V. In very rare cases a 2.5" hard disk also requires a 12 V line, which is not supported (e.g. Seagate Constellation® series).
