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Support | |
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Evolution of the I.C.E.
The Integrated Cooling Engine included with the current Shuttle XPCs improves on the previous XPC I.C.E. design. The I.C.E. module’s thermal resistance has been decreased to an amazing 0.16º C/W (1). This is less half the thermal resistance of first generation Shuttle XPCs and only one-third that of Intel’s BTX standard. Further, the heat exchange surface area has been increased as have the number of radiator fins. Lastly, it sports a generous 92mm cooling fan to quietly push more air out the back of the case.
I.C.E.
Generation |
Thermal
capacity |
Fan
diameter |
Fan
connector |
max.
Airflow (3) |
termal
resistance (1) |
| 1st Gen. |
80 W |
80 mm |
3 pins |
25 CFM |
0.33 °C/W |
| 2nd Gen. |
100 W |
80 mm |
3 pins |
35 CFM |
0.22 °C/W |
| 3rd Gen. |
120 W + |
92 mm |
4 pins (2) |
50 CFM |
0.16 °C/W |
(1) 0.22 °C/W means a 22 degrees higher temperature compared to the environment with a heat dissipation of 100W.
(2) 4 pin fan connector for improved RPM (revolutions per minute) speed control by PWM (pulse width modulation)
(3) CFM means "cubic feet per minute". Cubic feet is a unit of measurement for volume. One cubic meter equals 35.3 cubic feet.
Evolution
These 4-pin header for all RPM controlled fans are standard on current Shuttle XPCs. |
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