Path: Home Products Mainboards Socket 478 VIA-chipset AV41P Info/FAQ CPU Support List AV41P

Mainboard AV41P

Version mark next to the outermost
PCI slot

Info and Frequently asked questions

CPU Support List AV41P

FSB	Multiplier	Processor
133MHz	23x	Intel Pentium 4 socket 478 3.06 GHz
133MHz	21x	Intel Pentium 4 socket 478 2.80 GHz
133MHz	20x	Intel Pentium 4 socket 478 2.66 GHz
133MHz	19x	Intel Pentium 4 socket 478 2.53 GHz
100MHz	25x	Intel Pentium 4 socket 478 2.50 GHz
133MHz	18x	Intel Pentium 4 socket 478 2.40 GHz
100MHz	24x	Intel Pentium 4 socket 478 2.40 GHz
133MHz	17x	Intel Pentium 4 socket 478 2.26 GHz
100MHz	22x	Intel Pentium 4 socket 478 2.20 GHz
100MHz	20x	Intel Pentium 4 socket 478 2.00 GHz
100MHz	19x	Intel Pentium 4 socket 478 1.90 GHz
100MHz	18x	Intel Pentium 4 socket 478 1.80 GHz
100MHz	17x	Intel Pentium 4 socket 478 1.70 GHz
100MHz	16x	Intel Pentium 4 socket 478 1.60 GHz
100MHz	15x	Intel Pentium 4 socket 478 1.50 GHz
100MHz	28x	Intel Celeron socket 478 2.80 GHz
100MHz	26x	Intel Celeron socket 478 2.60 GHz
100MHz	25x	Intel Celeron socket 478 2.50 GHz
100MHz	24x	Intel Celeron socket 478 2.40 GHz
100MHz	23x	Intel Celeron socket 478 2.30 GHz
100MHz	22x	Intel Celeron socket 478 2.20 GHz
100MHz	21x	Intel Celeron socket 478 2.10 GHz
100MHz	20x	Intel Celeron socket 478 2.00 GHz
100MHz	18x	Intel Celeron socket 478 1.80 GHz
100MHz	17x	Intel Celeron socket 478 1.70 GHz
Remarks: 1. CPU internal core bus speed runs at 400/533MHz

What kind of memory does AV41P V5.0 support?

AV41P V5.0 supports PC 100/133 compliant SDRAM up to 2GB capacity. It also supports PC 1600/2100/2700 compliant DDR up to 2GB capacity.

Can I use adhesive thermal silicone gel on P4 CPU die?

Adhesive thermal silicone gel such as Shin-Etsu Silicone will set after about 6 hours and form a strong bond between the heatsink and CPU die or other applied surfaces (eg. memory module, chipsets). This type of adhesive thermal compound is strongly not recommended to use on P4 Socket 423/478 CPU die. Since fan heatsink will stick strongly to the P4 CPU die and due to P4 Socket 423/478 ZIF socket structural design, upon removal of the heatsink will force P4 CPU to break apart from the ZIF socket thus damaging both pins on P4 CPU and ZIF socket. Please use non-adhesive thermal compound for P4 CPU only to avoid any damage done to the ZIF socket and P4 CPU.

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